Method ​

• FIB preparation of lamella and lift-off for microscopy

• Sub nm imaging using TEM or STEM 

• In-situ EDX  elemental mapping or EELS 

• Electron diffraction analysis (lattice parameter)

• ​Plan view or cross section analysis 
   

Applications 

• Microstructure & defects

• Layer thickness measurements.

• Failure analysis

• Reverse engineering
   

Materials 

• Silicon, III/V and II/VI semiconductors

• Patterned wafers , devices or plain samples

• PVD, CVD and ALD coatings and thin films

• Optical coatings

• Particles and fibers